Long-time Slashdot reader UnknowingFool writes: Last week IBM announced their next generation mainframe CPU Telum. Manufactured by Samsung’s 7nm node, each Telum processor has 8 cores with each core running at a base 5GHz. Two processors are combined in a package similar to AMD’s chiplet design. A drawer in each mainframe can hold 4 packages (sockets), and the mainframe can hold 4 drawers for combined 256 cores.
Link: IBM’s New Mainframe 7nm CPU Telum: 16 Cores At 5GHz, Virtual L3 and L4 Cache